YES CV200 RFS Plasma Strip / Descum System
YES CV200 RFS Plasma Strip / Descum System
Yield Engineering Systems - CV200 RFS
SHyNE Resource
The University of Chicago
Pritzker Nanofabrication Facility (PNF)
- Cleaning
- All Cleaning
- Plasma/Stripper
Description
The YES CV200 RFS Plasma Strip / Descum System is used for the removal of thick layers of photoresist or polymide in short production times; accomodating the strict requirements of contemporary front-end semiconductor processing equipment. The YES CV200 RFS operates in two main modes, a powerful plasma stripping mode removes tough and / or thick resists while a gentler descum mode can be used to deal with the cleaning of inorganic substrates.
Maximum Substrate Size
8 inch