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Wire Bonder

Wire Bonder

West Bond

CNS Harvard University Center for Nanoscale Systems (CNS)
  • Packaging
    • All Packaging
      • Bonding
Description
Wedge bonder configured for aluminum wire (.001_). It will attach to pads down to 100 microns square in a feature density of 150 microns (pad to pad) The system is tuned for bonding the wire to Au but will work on Al ,Cu with a tip change and some parameter adjustment.
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