Wire Bonder
Wire Bonder
West Bond
CNS
Harvard University
Center for Nanoscale Systems (CNS)
- Packaging
- All Packaging
- Bonding
Description
Wedge bonder configured for aluminum wire (.001_). It will attach to pads down to 100 microns square in a feature density of 150 microns (pad to pad) The system is tuned for bonding the wire to Au but will work on Al ,Cu with a tip change and some parameter adjustment.