Thermco LPCVD Poly 1/2
Thermco LPCVD Poly 1/2
Thermco Systems
nano@stanford
Stanford University
Stanford Nanofabrication Facility
- Thin Film Processing
- Dielectric
- CVD
Description
Polycrystalline silicon (also called "poly-Si" or "poly") is deposited at a low pressure (~500 mtorr) using silane (SiH4). The tube has a sloping temperature profile to accommodate depletion of reactants. Deposition temperature is ~620C for polysilicon and ~520C for amorphous silicon. This furnace can handle wafers up to 6 inch and is plumbed with GeH4, PH3 and B2H6.
Maximum Substrate Size
6 inch