Suss SB8e Substrate Bonder

The Suss SB8e VAC substrate bonder is universal tool for bonding processes for micro-electro-mechanical system applications such as Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding and Thermal Compression Bonding. When used in conjuction with the MA6/BA6 it can do aligned bonding of wafers. Wafers are prealigned in the MA6 and then the entire chuck is transferred to the bonder. It can vacuum down to 5x10e-5 mbar with an overpressure up-to3 bar and temperature to 550C.