Suss MicroTec AltaSpray Automated Spray Coated AS8
Suss MicroTec AltaSpray Automated Spray Coated AS8
SUSS MicroTec - AS8
MANTH
University of Pennsylvania
Singh Center for Nanotechnology
- Lithography
- All Lithography
- Resist Processing
Description
Suss MicroTec AltaSpray Automated Spray Coated AS8
Automated Spray Coater for High Topographies
SUSS MicroTecs proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90 corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600m or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging.
Wafer sizes from pieces to 200mm. Common resists sprayed are SU-8, S1800 and various AZ formulations.
Automated Spray Coater for High Topographies
SUSS MicroTecs proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90 corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600m or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging.
Wafer sizes from pieces to 200mm. Common resists sprayed are SU-8, S1800 and various AZ formulations.
Maximum Substrate Size
8 inch