SUSS MA6 Mask Aligner
SUSS MA6 Mask Aligner
suss microtec - MA6
CNS
Harvard University
Center for Nanoscale Systems (CNS)
- Lithography
- All Lithography
- UV
Description
The SUSS MA6 Mask Aligner is the highest resolution contact mask aligner available at the CNS, with sub-micron feature capability in positive tone resists. In addition to the highly accurate topside alignment capability, the MA6 can perform front-to-backside alignment with the use of a second alignment microscope.
Comments
Major functions, features, and benefits: *Topside(TSA) and Backside(BSA) alignment *Achievable exposure resolution 0.6 um, alignment resolution better than 1um *Maximum substrate size 6" *Able to perform soft, hard, low vacuum and vacuum contact, as well as proximity exposure *Restricted to positive-tone photoresists *Minimum alignment mark separation for binocular vision: 5 cm *Training is offered on-demand, typically after users have been trained on the MJB4 mask aligner.