Suss MA6-BA6 Contact Aligner
Suss MA6-BA6 Contact Aligner
Suss Microtech - MA6/BA6
CNF
Cornell University
Cornell NanoScale Science & Technology Facility (CNF)
- Lithography
- All Lithography
- UV
Description
The MA6 is a workhorse contact lithography system (contact aligner) for up to 150 mm wafers. It can align to features on either the front or the back of the wafer using a video alignment system. The versatile mask holder allows both round and square plates as masks, and the sample plate accommodates small and odd-shaped substrates. It can also be used in conjunction with the SB8e for aligned wafer bonding.
Maximum Substrate Size
6 inch