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Suss MA6-BA6 Contact Aligner

Suss MA6-BA6 Contact Aligner

Suss Microtech - MA6/BA6

CNF Cornell University Cornell NanoScale Science & Technology Facility (CNF)
  • Lithography
    • All Lithography
      • UV
Description
The MA6 is a workhorse contact lithography system (contact aligner) for up to 150 mm wafers. It can align to features on either the front or the back of the wafer using a video alignment system. The versatile mask holder allows both round and square plates as masks, and the sample plate accommodates small and odd-shaped substrates. It can also be used in conjunction with the SB8e for aligned wafer bonding.
Maximum Substrate Size
6 inch
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