STS PECVD
STS PECVD
Surface Technology Systems
CNS
Harvard University
Center for Nanoscale Systems (CNS)
- Thin Film Processing
- Dielectric
- PECVD
Description
Equipment: This STS PECVD system is a dual frequency powered parallel electrode reactor. Its top electrode is powered with two generators. One is a standard rf and also called high frequency power supply (HF, 13.56 MHz). Its power control range is 10W to 600W. The second one is a low frequency (LF, 380 kHz) power supply with a power range of 10W to 1000W. The tool has three operation modes, HF, LF, and MF (mixed frequency). Under MF, the top electrode is powered alternately with HF and LF to tailor film stress by varying the HF/LF power-on ratio. The substrate temperature control is from room temperature to 300C. Applications: Films that can be deposited using this tool include: SiO2, Si3N4, low-stress Si3N4, amorphous Si, phosphorus and boron doped all above films. Features: High and low frequency powered up electrode
- Temperature controlled sample stage up to 300C
- Single wafer loadlock up to 6" wafer
- Available gases: SiH4, NH3, N2O, N2, O2, Ar, 10%PH3/Ar, and 10% B2H6/H2.
- Windows 2000 software control PC
- Internet remote control capability
- Temperature controlled sample stage up to 300C
- Single wafer loadlock up to 6" wafer
- Available gases: SiH4, NH3, N2O, N2, O2, Ar, 10%PH3/Ar, and 10% B2H6/H2.
- Windows 2000 software control PC
- Internet remote control capability
SiH4: 12 sccm
N2O: 1420 sccm
N2: 392 sccm
Pressure: 550 mTorr
Power: 60W LF
Temperature: Platen at 300C and Lid at 250C
Deposition rate: 79 nm/min
Refractive index: 1.48 Process II. Recipe Name: HFSIO
SiH4: 10 sccm
N2O: 1420 sccm
N2: 392 sccm
Pressure: 900 mTorr
Power: 30W HF
Temperature: Platen at 300C and Lid at 250C
Deposition rate: 56 nm/min
Refractive index: 1.485 Si3N4 Films. Process I Recipe Name: LFSIN
SiH4: 40 sccm
NH3: 20 sccm
N2: 1960 sccm
Pressure: 550 mTorr
Power: 60W LF
Temperature: Platen at 300C and Lid at 250C
Deposition rate: 45 nm/min
Refractive index: 1.977 Process II Recipe Name: HFSIN
SiH4: 40 sccm
NH3: 55 sccm
N2: 1960 sccm
Pressure: 900 mTorr
Power: 20W HF
Temperature: Platen at 300C and Lid at 250C
Deposition rate: 10 nm/min
Refractive index: 2.01