STS AOE ICP

The Advanced Oxide Etch (AOE) source is a revolutionary design, based on STS' well-established Inductively Coupled Plasma (ICP) technology. The AEO source is originally conceived to overcome the limitations of conventional high density plasma sources for SiO2 deep etch applications. It is also proven to be suitable for deep etching of quartz, pyrex, and fused silica for 4" substrates and 6" substrates by request. System Components: Reaction chamber, loadlock, throttle valve, pressure guage, MFCs, turbo pump, mechanical pump, chillers. Equipment Identification: Model Number: Multiplex ICP, Serial Number: 19743, GT ID Number: 145831