Sputter deposition
Sputter deposition
Kurt Lesker - PVD75
RTNN
University of North Carolina
Chapel Hill Analytical and Nanofabrication Laboratory (CHANL)
- Thin Film Processing
- Dielectric
- Sputter
Description
The PVD 75 magnetron sputtering system is used for deposition of metals and metal oxides. The substrate temperature can be controlled from 25C to 350C, and materials available for sputtering include Ag, Al, Au, Co, Cr, Cu, Fe, Ni, and Ti.
Maximum Substrate Size
6 inch