Semi-Automatic Wire Bonder

For process development, production, research or added manufacturing support, K&S 4500 Series Manual Wedge Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding applications, including: Optoelectronic Modules, Hybrid/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Board Semi-automatic and manual operation modes, individual bond parameter control, and capacity for a wide range of wire diameters enable ease of use in ball bonding, ball bumping, coining, security bonding and single-point TAB applications.