PlasmaTherm Shuttlecock PECVD System
PlasmaTherm Shuttlecock PECVD System
Plasma-Therm - Shuttlecock
nano@stanford
Stanford University
Stanford Nanofabrication Facility
- Thin Film Processing
- Dielectric
- PECVD
Description
The PlasmaTherm Shuttlelock SLR-730-PECVD system is used for the deposition of silicon nitrides, oxides, and carbides on a variety of substrates.
Maximum Substrate Size
6 inch