Plasma Therm Versaline LL ICP Metal Etcher
Plasma Therm Versaline LL ICP Metal Etcher
Plasma-Therm - Versaline
nano@stanford
Stanford University
Stanford Nanofabrication Facility
- Etching
- Dry
- ICP
Description
Default config: 4"; Versaline LL-ICP Metal Etcher offers precision metal etching on a flexible range of substrate types. PT-MTL can be configured to etch either 4" or 6" wafers and the default configuration is 4".
Maximum Substrate Size
6 inch