Plasma Therm Versaline DSE
Plasma Therm Versaline DSE
PlasmaTherm/Unaxis/Oerlikon - Versaline
TNF
University of Texas at Austin
Microelectronics Research Center (MRC)
- Etching
- Dry
- Deep Silicon (Bosch)
Description
For deep Si trench and SOI wafer etch; Bosh process: C4F8/SF6
Maximum Substrate Size
6 inch