Plasma Therm SLR RIE
Plasma Therm SLR RIE
Plasma-Therm -
SENIC
Georgia Tech
Institute for Electronics and Nanotechnology Micro/Nano Fabrication Facility
- Etching
- Dry
- RIE
Description
The Plasma-Therm SLR RIE is an automatically loaded Reactive Ion Etcher (RIE) plasma system. It is used to etch IIIV materials and metals. The Plasma-Therm SLR RIE can be used to process polymers including photoresist masks. Capability: Gallium Arsenide (GaAs); Aluminum (Al); Chrome (Cr); Titanium (Ti). RIEs (Reactive Ion Etcher) are used to etch various materials, such as semiconductors, polymers, and various metals using reactive gases in a RF (radio frequency) reactive ion plasma. This RIE system operates at 13.56 MHz and etches III-V materials and metals such as Al, Cr, and Ti. Small pieces up to 10" substrates are allowed in this system.
Maximum Substrate Size
10 inch