Plasma Therm RIE
Plasma Therm RIE
Plasma-Therm -
SENIC
Georgia Tech
Institute for Electronics and Nanotechnology Micro/Nano Fabrication Facility
- Etching
- Dry
- RIE
Description
RIEs (Reactive Ion Etcher) are used to etch various materials, such as semiconductors, polymers, and various metals using reactive gases in a RF (radio frequency) reactive ion plasma. This RIE system operates at 13.56 MHz and has two chambers that are used for the etching of dielectrics and metals such as Al, Cr, and Ti. Small pieces up to 10"; substrates are allowed in this system.
Maximum Substrate Size
10 inch