Plasma-Therm ICP Fluoride Etch
Plasma-Therm ICP Fluoride Etch
PLASMA-THERM LLC - APEX SLR (ICP)
SHyNE Resource
The University of Chicago
Pritzker Nanofabrication Facility (PNF)
- Etching
- Dry
- ICP
Description
The Plasma-Therm ICP (Inductively Coulped Plasma) Fluoride Etch is an etching system which uses fluoride solutions to etch metal films and compound semiconductors. Fluoride plasma etching differs from Chlorine etching (seePlasma-Therm ICP Chlorine Etch) in respect of the chemistries, Chlorine and Fluoride based, used in each.
Maximum Substrate Size
6 inch