Plasma Enhanced Chemical Vapor Deposition (PECVD)
Plasma Enhanced Chemical Vapor Deposition (PECVD)
STS - LpX CVD
SHyNE Resource
Northwestern University
Northwestern University Micro/Nano Fabrication Facility (NUFAB)
- Thin Film Processing
- Dielectric
- PECVD
Description
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STS LpX CVD is for the deposition of silicon dioxide (SiO2), silicon nitride (Si3N4), and amorphous silicon.
STS LpX CVD is for the deposition of silicon dioxide (SiO2), silicon nitride (Si3N4), and amorphous silicon.
Maximum Substrate Size
4 inch