Perkin Elmer DMA 8000 Dynamic Mechanical Analyzer
Perkin Elmer DMA 8000 Dynamic Mechanical Analyzer
Perkin Elmer - DMA 8000
SENIC
Joint School of Nanoscience and Nanoengineering
Joint School of Nanoscience and Nanoengineering
- Metrology/Characterization
- Thin Film
- Mechanical
Description
Dynamic Mechanical Analysis (DMA) is used to characterize materials' bulk properties such as modulus, compliance and damping (tan delta). It measures changes of rheological behavior under dynamic conditions as a function of temperature, time, frequency, stress, atmosphere, or a combination of these parameters. Stress-strain, creep recovery, thermomechanical and stress relaxation measurements are examples
Comments
Any size sample can be cut using the waterjet