Oxford PlasmaLab 80+ (DE-04)
Oxford PlasmaLab 80+ (DE-04)
Oxford Instruments - Plasmalab 80 Plus
MANTH
University of Pennsylvania
Singh Center for Nanotechnology
- Etching
- Dry
- RIE
Description
A compact open-loading tool for Reactive Ion Etching Oxford 80+ RIE. The Oxford 80+ offers versatile reactive ion etch solutions on one platform with convenient open loading.
It can process from the smallest wafer pieces to 200mm wafers. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production.
600W RF generator
Up to 200mm wafers
Process gases: CF4, Ar, O2, SF6 and CHF3
Excellent etch control
Excellent process control
Documented baseline recipes are provided by Penns QNF staff
It can process from the smallest wafer pieces to 200mm wafers. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production.
600W RF generator
Up to 200mm wafers
Process gases: CF4, Ar, O2, SF6 and CHF3
Excellent etch control
Excellent process control
Documented baseline recipes are provided by Penns QNF staff
Maximum Substrate Size
8 inch
Comments
CHF3, CF4, SF6, O2, Ar for Si , SiO2, SiNx, Ti, W, Mo, and W