MRC Reactive Ion Etcher
MRC Reactive Ion Etcher
Material Research Corporation
nano@stanford
Stanford University
Stanford Nanofabrication Facility
- Etching
- Dry
- RIE
Description
The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including oxides, nitrides, silicons, and some organic films. This system accommodates the most etch processing needs for non-CMOS compatible materials. It is a manual system which can accommodate wafer pieces and wafers up to 6".
Maximum Substrate Size
6 inch