Matrix Plasma Asher

The Matrix 105 represents the industry standard in single-wafer photoresist removal and the mainstay of the highly successful plasma descum system for the semiconductor industry.
The system reduces carbon-chain polymer resist in a non damaging environment. Its design incorporates close loop control of vital process parameters, which in turn eliminate device damage that could be both thermal and electrical. The Matrix is a plasma asher (oxygen plasma) using a single 600 watt RF generator. It has a heated chuck capable of 250 deg. C operating temperature. The system is process driven through menu commands and can be programmed for a maximum of 3 step processes plus over etch when using the spectrum endpoint detector. Each step can allow independent control of RF power, oxygen flow, pressure, and up / down movement of the wafer. The pic and place handler is set up to use 6 wafers. Rates
1.2 2.5 u/min on resist