Manual Flip Chip Bonder
Manual Flip Chip Bonder
SENIC
Georgia Tech
Institute for Electronics and Nanotechnology Micro/Nano Fabrication Facility
- Packaging
- All Packaging
- Bonding
Description
This flip chip bonder is currently only for PRC use. It can perform thermocompression, thermosonic, and reflow bonding with up to 20N of force. It can align with a 1 micron accuracy, and handle substrates up to 10mm in size.
Restrictions