Logitech CMP
Logitech CMP
Logitech - Orbis
CNF
Cornell University
Cornell NanoScale Science & Technology Facility (CNF)
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Description
The Logitech Orbis is a CMP tool capable of polishing 4 and 6 inch whole wafers (pieces may be possible with construction of a special template). It can do automatic multistep polishing processes with diamond disk pad conditioning to maintain etch rates stability. The tool can be used for planarization or for damascene polishing of silicon oxide, silicon nitride, polysilicon, copper, tungsten, and other various metals. A variety of pads and slurries are available for different applications.
Maximum Substrate Size
8 inch