Lesker PVD 75 (PVD-04)
Lesker PVD 75 (PVD-04)
Kurt J. Lesker Company - PVD 75
MANTH
University of Pennsylvania
Singh Center for Nanotechnology
- Thin Film Processing
- Metal
- Evaporation
Description
Load locked system
Four pocket e-beam at 10kV
Cryo pumped with automated interface
Automated control of film thickness
Accepts pieces through 150mm wafers
Wafer platen rotation
Four pocket e-beam at 10kV
Cryo pumped with automated interface
Automated control of film thickness
Accepts pieces through 150mm wafers
Wafer platen rotation
Restrictions
Ti, Au, Pd, Cr only
Maximum Substrate Size
6 inch
Comments
Ti, Au, Pd, Cr sources only