K&S 4523AD Wire Bonder
K&S 4523AD Wire Bonder
Kulicke & Soffa - 4523AD
MONT
Montana State University
Montana Microfabrication Facility (MMF)
- Packaging
- All Packaging
- Bonding
Description
The K&S 4523AD is a wedge bonder typically used for making electrical connections between MEMS or IC die and external packaging. Manual, semiautomatic and automatic operating modes can be selected for the required application.
Maximum Substrate Size
4 inch