K&S 1472 Wire Bonder 1
K&S 1472 Wire Bonder 1
K &S Precision Metals - 1472
SENIC
Georgia Tech
Institute for Electronics and Nanotechnology Micro/Nano Fabrication Facility
- Packaging
- All Packaging
- Bonding
Description
The K&S 1472 is a wedge wire bonder. The system is currently configured for aluminum wire. The bonder can be operated in semi-automatic or fully automatic modes.
Restrictions