GnP Poli-400L
GnP Poli-400L
G and P Technology - GnP Poli-400L
nano@stanford
Stanford University
Stanford Nanofabrication Facility
- Packaging
- All Packaging
- CMP
Description
The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4 wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surface, as well as, to smooth surface roughness.
Maximum Substrate Size
4 inch