Flipchip Bonder
Flipchip Bonder
Fintech USA - Lambda
nano@stanford
Stanford University
Stanford Nanofabrication Facility
- Packaging
- All Packaging
- Bonding
Description
The Finetech Lambda is a flipchip bonder with a bonding area of 35 mm X 35 mm and capable of handling substrates up to 100 mm.
Maximum Substrate Size
4 inch