Flip-Chip Bonder
Flip-Chip Bonder
Finetech - Lamba Manual
NNI
University of Washington
Washington Nanofabrication Facility (WNF)
- Packaging
- All Packaging
- Bonding
Description
Die bonder that uses cameras and beam splitter to image die face and substrate simultaneously to achieve better than 5um alignment. Unit has thermosonic and thermocompression bonding.
Restrictions
None
Maximum Substrate Size
4 inch