Flip Chip Bonder

Flip chip microelectronic assembly is the direct electrical connection of face-down (hence, "flipped") electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. In contrast, wire bonding, the older technology which flip chip is replacing, uses face-up chips with a wire connection to each pad. The FINEPLACER Pico is FINETECHs can be used for a wide array of flip chip bonding such as solder reflow/rework, anisotropic conductive film, non conductive adhesive, ultrasonic bonding etc. On one hand, the Pico offers highest accuracy (5 m /0.2 mil) placement error, allowing to bond smallest dies with a pitch of down to 50 m. On the other hand it offers enough accessibility to be used for nearly all large standard surface mounted components up to 17 mm side length.