FEI Nova Nanolab 200 FIB/SEM

FEI - Nova Nanolab 200

SENIC Georgia Tech Materials Characterization Facility

Imaging
- All Imaging
  - FIB
Metrology/Characterization
- Thin Film
  - EDS/WDS

Description

The Nova Nanolab combines ultra-high resolution field emission scanning electron microscopy (SEM) and precise focused ion beam (FIB) etch and deposition. It allows nanoscale prototyping, machining, 2D and 3D-characterization and analysis.- With Oxford EDX. Resolution @ 5 kV (TLD-SE)- 2.0nm- Minimum deposition line width: 30 nm-Minimum etched Si line width: ~20nm