EVG620 Lithography System
EVG620 Lithography System
EVG - EVG620
SDNI
University of California, San Diego
Nano3 Cleanroom Facility
- Lithography
- All Lithography
- UV
Description
EVG620NT Semi-automated Double Side Mask Alignment System (up to 150mm, double side, manual handling)
Exposure modes: hard-, soft- and vacuum contact, proximity
Separation distance 0-300 um adjustable via software
Wafer size up to 100 mm, pieces down to 20mmx20mm.
Wafer thickness 0.1 - 10 mm (for top side configuration only)
Mask size 7inchx7inch, 5inchx5inch or 4inchx4inch.
Semi automatic loading with mechanical prealignment on chuck
Quick change of mask and chuck
Tooling for soft UV-Nanoimprinting & Micro Contact Printing
Exposure modes: hard-, soft- and vacuum contact, proximity
Separation distance 0-300 um adjustable via software
Wafer size up to 100 mm, pieces down to 20mmx20mm.
Wafer thickness 0.1 - 10 mm (for top side configuration only)
Mask size 7inchx7inch, 5inchx5inch or 4inchx4inch.
Semi automatic loading with mechanical prealignment on chuck
Quick change of mask and chuck
Tooling for soft UV-Nanoimprinting & Micro Contact Printing
Maximum Substrate Size
6 inch