EVG 510 Wafer Bonder
EVG 510 Wafer Bonder
EVG - EVG 510
MANTH
University of Pennsylvania
Singh Center for Nanotechnology
- Packaging
- All Packaging
- Bonding
Description
The EVG501 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers. The new tool supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere.
Features
Bonds up to 10 kN force at temperatures up to 450C
Real and low-force wafer wedge compensation system for highest yield
Large process window: temperature uniformity <+/- 1% and pressure uniformity
<+/- 5%
Features
Bonds up to 10 kN force at temperatures up to 450C
Real and low-force wafer wedge compensation system for highest yield
Large process window: temperature uniformity <+/- 1% and pressure uniformity
<+/- 5%
Maximum Substrate Size
8 inch