EVG 501 Wafer Bonder

The EVG 501 is a wafer bonding station capable of running 6 substrate with the current setup we have. Tool has the capability of doing: 1.Eutectic bonding: uses temperature and pressure only; uses an intermediate metal layer (usually gold), 2. Thermal compression bonding: Uses temperature and pressure only; bonding of metal to metal layers 3. Direct or fusion bonding: Can be done only with oxide intermediate layer to lower the bonding temperature; 4. Bonding quality IR testing: Use IR projector to verify the bonding uniformity and rough alignment check