EV Group Wafer Bonder

The EV Group system is comprised of the precision optical 620 Aligner and the 501 Wafer Bonder. The Bonder module includes a Megasonic station for ultrasonic cleaning of wafers before alignment. Using the specially provided bond tool, wafers to be bonded are aligned on the 620 Aligner and then placed in the 501 Bonder for processing. Although primarily used for anodic bonding, the 501 Bonder is compatible with several other bonding modes, including: compression, direct Si-Si, low temperature eutectic/frit bonding. Our current configuration accommodates 100 mm round wafers and pieces.