DISCO Wafer Saw
DISCO Wafer Saw
DISCO Corporation - DAD 3240
nano@stanford
Stanford University
Stanford Nanofabrication Facility
- Packaging
- All Packaging
- Dicing
Description
DISCO Wafer Saw - DAD3240 - Capable of cutting silicon, glass and quartz substrates up to 8" circles.
Maximum Substrate Size
8 inch