Disco Backgrind
Disco Backgrind
Disco - DAG810
nano@stanford
Stanford University
Stanford Nanofabrication Facility
- Packaging
- All Packaging
- Other
Description
DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. This tool can process sample pieces to 8 inch wafers. Reproducibility is less than 1.5um across an 8 inch surface and surface roughness possible is better than 150nm.
Maximum Substrate Size
8 inch