Disco Automatic Dicing Saw 3220
Disco Automatic Dicing Saw 3220
Disco - DAD 3220
SDNI
University of California, San Diego
Nano3 Cleanroom Facility
- Packaging
- All Packaging
- Dicing
Description
Precision dicing tool capable of cutting silicon, quartz, alumina and III-V substrates, up to 6 inches in diameter and up to 1mm thick.
Maximum Substrate Size
6 inch