Dicing Saw-DISCO
Dicing Saw-DISCO
Disco - DAD 3240
CNF
Cornell University
Cornell NanoScale Science & Technology Facility (CNF)
- Packaging
- All Packaging
- Dicing
Description
The DISCO DAD3240 is a dicing saw capable of handling up to 8 inch substrates with a thickness of up to 1.25 mm. Applications that have benefited from the DISCO approach include the dicing of silicon, bonded Si wafers, and all types of glasses.
Maximum Substrate Size
8 inch