Deep Reactive Ion Etching System - STS MESC Multiplex ICP
Deep Reactive Ion Etching System - STS MESC Multiplex ICP
SPTS - MESC Multiplex ICP
KY Multiscale
University of Louisville
Micro Nano Technology Center (MNTC)
- Etching
- Dry
- Deep Silicon (Bosch)
Description
This machine is called the DRIE, which stands for Deep Reactive Ion Etcher. This product allows for the copying of a specific pattern onto silicon wafers. This is achieved through etching using specific gases. This machine is also capable of holding multiple wafers at a single time so the same procedure does not need to be repeated for each one.