Deep Reactive Ion Etcher (DRIE)
Deep Reactive Ion Etcher (DRIE)
STS - LpX Pegasus
SHyNE Resource
Northwestern University
Northwestern University Micro/Nano Fabrication Facility (NUFAB)
- Etching
- Dry
- Deep Silicon (Bosch)
Description
Deep silicon (Si) etching with processes including high rate etching, high aspect ratio, through-wafer etches and etching to buried oxide layers, including SOI wafers.
Maximum Substrate Size
4 inch