Bowoptic Stress Measurement
Bowoptic Stress Measurement
BowOptic - 208
SENIC
Georgia Tech
Institute for Electronics and Nanotechnology Micro/Nano Fabrication Facility
- Metrology/Characterization
- Thin Film
- Mechanical
Description
The BowOptic 208 is an automatic wafer stress measurement machine that uses a proven accurate method to measure wafer stress. Wafers sizes up to 8 can be loaded onto the chuck. The wafer moves automatically into the tool for precision measurement.