AWB04 Wafer Bonder

Applied Microengineering Ltd. - AWB04

MONT Montana State University Montana Microfabrication Facility (MMF)

Packaging
- All Packaging
  - Bonding

Description

Unique in-situ alighnment sytem (X,Y,Z & θ), 1-5 micron alignment accuracy depending on options & wafers, automatic PC control & data acquitisio, appicaiton of high voltage up to 2.5KV, temeratures up to 560 degrees C, forces up to 25,000N, self-contaitned dry pumping system for cacuum up to up to 10-6 mBar range, forced nitrogen cooling, 3"-6"wafers

Maximum Substrate Size

6 inch