Angstrom Nexdep Thermal E-Beam Evaporator
Angstrom Nexdep Thermal E-Beam Evaporator
Angstrom Engineering - NEXDEP 206
SHyNE Resource
The University of Chicago
Pritzker Nanofabrication Facility (PNF)
- Thin Film Processing
- Metal
- Evaporation
Description
PVD tool that offers E-Beam and Thermal evaporation for a variety of high melting point substrates. The NexDep can be configured for a variety of PVD processes including resistive thermal evaporation, sputter and ion assisted deposition, and principal E-Beam and Thermal evaporation capacities.
Maximum Substrate Size
6 inch