AMT Oxide Plasma Etcher
AMT Oxide Plasma Etcher
Applied Materials - AMT 8100
nano@stanford
Stanford University
Stanford Nanofabrication Facility
- Etching
- Dry
- RIE
Description
The amtetcher is a Reactive Ion Etcher that uses fluorine based chemistry to etch Oxides or Nitrides. Also can be used for Si trench etching.
Maximum Substrate Size
4 inch