AML Wafer bonder
AML Wafer bonder
AML - AWB04
TNF
University of Texas at Austin
Microelectronics Research Center (MRC)
- Packaging
- All Packaging
- Bonding
Description
In-situ alignment 1 micron accuracy. 10-6mbar Vacuum to 2bar process gas. Alignment and bonding are performed in-situ in a high vacuum chamber.
Maximum Substrate Size
4 inch