AJA ATC 2200 UHV Sputtering System
AJA ATC 2200 UHV Sputtering System
AJA International Inc - ATC2200
SHyNE Resource
The University of Chicago
Pritzker Nanofabrication Facility (PNF)
- Thin Film Processing
- Metal
- Sputter
Description
PVD tool which deposits films on a substrate by a method known as sputtering. Magnetron sputtering uses accelerated, positively charged ions from a plasma source to deposit films with an increased deposition rate and more controlled electron bombardment than evident in other sputtering systems (such as diode sputtering)
Maximum Substrate Size
6 inch