ADT 7100 Dicing Saw
ADT 7100 Dicing Saw
K&S/ADT - 7100Pro
TNF
University of Texas at Austin
Microelectronics Research Center (MRC)
- Packaging
- All Packaging
- Dicing
Description
Optimized for single substrate dicing of thick material applications up to 150 mm x 150 mm with a relatively low unit cost per device, such as:Ceramic Substrates, Thick-film DevicesHybridsAlumina
Maximum Substrate Size
6 inch