Most NNCI sites desire users to access the facilities on-site, where the user is trained and performs the work themselves, under the guidance of expert staff. However, many sites also offer opportunities for remote (off-site) work, where the site staff performs the work for the user and only materials are exchanged. The guidelines for what remote work is accepted is determined solely by the site itself.
For those occasions where site staff are unable to perform the remote work, some sites have local, independent contractors/consultants who can perform the work on a fee-for-service basis. These contractors are not formally affiliated with the site but are trained facility users and have expertise in fabrication and/or characterization methods. We provide the list below for information purposes only, and do not endorse nor guarantee the services of these contractors. Potential users of these contractors must do their own due diligence and negotiate terms and conditions of service directly with the contractor.
|NNCI Site||Contractor Name||Company Name||Fabrication or Characterization||Services Offered||Local Only or Travel|
|CNF||See CNF listing|
|MANTH||Stephen Jones||Jones Nanofabrication||Fabrication and Characterization||More than 30 years experience hands-on fabricating semiconductor and MEMS devices. Employed by large (IBM, Seagate, Google) and small (Kionix, AMD) companies as well as fabricating MEMS devices for both university and industrial customers. Trained to use the facilities at both UPENN and Cornell.||firstname.lastname@example.org||Travel|
|MINIC||John Snyder||JCap, LLC||Fabrication and Characterization||Contract semiconductor fabrication services for MEMS/microelectronics. Photomask design/fabrication. Physical and electrical characterization/analysis of completed devices. Expertise in semiconductor device physics including thermal or electrical modeling/simulation at device or circuit email@example.com||Travel|
|MONT||Chris Arrasmith||Fabrication and Characterization||lithography, thin film deposition (evaporation and sputter), general wet bench processes, etching (ICP and wet), profilometry, inspection and characterization, microfluidics, MEMSfirstname.lastname@example.org||Travel|
|MONT||Clay Hunt||Characterization||XRD: Peak finding capabilities, some lattice parameter calculation abilities, SEM: Automated grain-size determination capability, EDXemail@example.com||Travel|
|nano@Stanford||See Stanford listing|
|NNI||Frank Garcia, Senior Microfabrication Engineer||RJC Enterprises, LLC||Mainly Fabrication||General R&D firstname.lastname@example.org||Local at UW WNF|
|RTNN||Brenda Prenitzer||Nanospective||Characterization||NanoSpective specializes in materials science with special emphasis on nanoscale materials characterization. The company provides analytical services and consultation to a worldwide market offering complete solutions for intellectual property issues, failure analysis, quality control, and materials research. Techniques include: Focused Ion Beam (FIB), Field Emission Transmission Electron Microscopy (FE TEM), Scanning Transmission Electron Microscopy (STEM), Electron Energy Loss Spectroscopy (EELS), Energy Filtered TEM (EFTEM), Energy Dispersive X-Ray Spectroscopy (X-EDS), Field Emission Scanning Electron Microscopy (FE SEM), Secondary Ion Mass Spectrometry (SIMS), Light Optical Microscopy (LOM), Backscattering Spectrometry (RBS), X-Ray Photoelectron Spectroscopy (XPS), Auger Electron Spectroscopy (AES), X-Ray Diffraction (XRD), Optical Testing, Surface Metrology, Raman Spectroscopy, Fourier Transform Infrared Spectroscopy (FTIR).||email@example.com||Travel|
|RTNN||Hessam Ghassemi||Characterization||1-Analysis and microanalysis of various materials and structures, using characterization techniques such as electron microscopes (SEM and TEM), Atomic force microscopy, XRD, etc.
2-Sample preparation, including planar view, cross-sectional, various types of nanostructures (1D and 2D) using mechanical polishing, FIB, wire bonding, electropolishing, dropcasting, etc.
3-In-Situ microscopy consulting, operation and optimization using various available systems, including Protochips, Hummingbird Scietific, Nanofactory, etc.
4-My field of expertise covers, semiconductors such as GaN and Si, nanostructures such as BN and C nanotubes, CdTe, Si and TiO2, thin films and oxide nanoelectronics such as BFO, LAO, BNT, etc, catalysts particles such Pt, Pd and Rh.
|SHyNE Resource||Yoshi Mizobuchi||YM Consultants, LLC||Fabrication and Characterization||Materials science and engineering relating to biochemical/biomedical/ industrial/process chemistry. Strength in R&D, problem solving, data analysis and interface firstname.lastname@example.org||Travel|
|SHyNE Resource||Nicolaie Moldovan||Alcorix Co.||Fabrication and Characterization||Micro-/nanofabrication services for prototyping and consulting in fabrication and integration of processes and email@example.com||Travel|
|TNF||Burt Fowler||SymboLight LLC||Fabrication and Characterization||Microfabrication Process Development, Photolithography Mask Design and Fabrication, Microelectronics / MEMS Consulting and Expert Witness Testimonyfirstname.lastname@example.org||Primarily Local at UT MRC|